Xilinx XC2V500 Virtex-II XC2V500-4FG456I IC FPGA 264 I/O 456 FBGA (8333)I

Xilinx XC2V500 Virtex-II XC2V500-4FG456I IC FPGA 264 I/O 456 FBGA (8333)I

$85 (USD)

Available quantity: 360

Goleta, CA

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Xilinx XC2V500 Virtex-II XC2V500-4FG456I IC FPGA 264 I/O 456 FBGA (8333)I New, OLD STOCK (2001). In excellent cosmetic condition. Close up photo of chip is provided, please see pictures for detail. Sealed bag was opened briefly for photos then resealed afterwards. These came from a large well known local thermal camera manufacturer. Manufacturer : Xilinx Model : XC2V500-4FG456I Includes : Virtex-II ($125 per chip) Specifications : ( These specifications were taken from the manufacturers website ) Series: Virtex-II Number of LABs/CLBs: 768 Total RAM Bits: 589824 Number of I/O: 264 Number of Gates: 500000 Voltage - Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40C ~ 100C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23) Base Product Number: XC2V500 Manufacture Year: 2001 Summary of Virtex-II Features : ( These features are directly from the Xilinx Data Sheet, available online from the manufacturers website) Industry First Platform FPGA Solution IP-Immersion Architecture - Densities from 40K to 8M system gates - 420 MHz internal clock speed (Advance Data) - 840+ Mb/s I/O (Advance Data) SelectRAM Memory Hierarchy - 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources - Up to 1.5 Mb of distributed SelectRAM resources High-Performance Interfaces to External Memory - DRAM interfaces SDR / DDR SDRAM Network FCRAM Reduced Latency DRAM - SRAM interfaces SDR / DDR SRAM QDR SRAM - CAM interfaces Arithmetic Functions - Dedicated 18-bit x 18-bit multiplier blocks - Fast look-ahead carry logic chains Flexible Logic Resources - Up to 93,184 internal registers / latches with Clock Enable - Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers - Wide multiplexers and wide-input function support - Horizontal cascade chain and sum-of-products support - Internal 3-state bussing High-Performance Clock Management Circuitry - Up to 12 DCM (Digital Clock Manager) modules Precise clock de-skew Flexible frequency synthesis High-resolution phase shifting - 16 global clock multiplexer buffers Active Interconnect Technology - Fourth generation segmented routing structure - Predictable, fast routing delay, independent of fanout SelectIO-Ultra Technology - Up to 1,108 user I/Os - 19 single-ended and six differential standards - Programmable sink current (2 mA to 24 mA) per I/O - Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards - PCI-X compatible (133 MHz and 66 MHz) at 3.3V - PCI compliant (66 MHz and 33 MHz) at 3.3V - CardBus compliant (33 MHz) at 3.3V - Differential Signaling 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers Bus LVDS I/O Lightning Data Transport (LDT) I/O with current driver buffers Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O Built-in DDR input and output registers - Proprietary high-performance SelectLink Technology High-bandwidth data path Double Data Rate (DDR) link Web-based HDL generation methodology Supported by Xilinx Foundation and Alliance SeriesDevelopment Systems - Integrated VHDL and Verilog design flows - Compilation of 10M system gates designs - Internet Team Design (ITD) tool SRAM-Based In-System Configuration - Fast SelectMAP configuration - Triple Data Encryption Standard (DES) security option (Bitstream Encryption) - IEEE 1532 support - Partial reconfiguration - Unlimited reprogrammability - Readback capability 0.15 m 8-Layer Metal Process with 0.12 m High-Speed Transistors 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies IEEE 1149.1 Compatible Boundary-Scan Logic Support Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm) Sold as is with 30day Right of Return, only pictured items included Easy return/refund for any reason Anacapa Equipment RETURNS Anacapa Equipment Brokers, Inc. 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Number of LABs/CLBs768
Total RAM Bits589824
Number of I/O264
Number of Gates500000
Voltage - Supply1.425V ~ 1.575V
Mounting TypeSurface Mount
Operating Temperature-40C ~ 100C (TJ)
Package / Case456-BBGA
Supplier Device Package456-FBGA (23x23)
Base Product NumberXC2V500
Manufacture Year2001
- Digitally Controlled Impedance (DCI) I/Oon-chip termination resistors for single-ended I/O standards